Earlier in December, Qualcomm uncovered the Snapdragon 845. The silicon chip is a flagship chip for 2018. It’s in the design of the chip that makes a phone a perfect combination. Most of the phones receive the hierarchy of Qualcomm powered chips. Three chips have leaked their specifications. Snapdragon 670, 640, & 460. These leaked specs have found in Weibo.
Complete Internal Cores of Snapdragon 670, 640, & 460
However, 670 replaces the existing 660 – a mid-range processor. The design of CPU rolls out with an octa-core and the manufacturing process makes it a measure of 10nm. The four Kryo 360 cores are clocked at 2 GHz and four Kryo 385 cores clocked at 1.6 GHz. Also, the chip has an Adreno 620 GPU.
The power of 670 can able a phone to have 26 MP or dual 13 + 13 MP shooters. Though it’s a step down to 845, it serves the best of its kind. Coming to its LTE Cat 16 with maximum speeds of 1 Gbps download and 150 Mbps upload.
Snapdragon 640 has a processor with a 6+2 core combinations. The two Kryo 360 cores clocked at 2.15 GHz and rest six Kryo 360 cores clocked at 1.55 GHz. The possibility to meet these criteria lies with ARM’s DynamIQ. This IQ matches and mixes up with Cortex-A75 and A55 CPU cores. Even this processor features 10-nm process and 1MB of system cache.
It has eight cores – four and four Kryo 360 cores clocked at 1.8 GHz and 1.4 GHz but has no system cache. It has the same modem as 640 but shows a difference in its ISP. The 460 has built on a 14-nm process.
In fact, Kryo CPU cores go in hand with Cortex-A75 and A55. Unlike previous processors which were used off-shelf-ARM process or fully custom Kryo cores, these processors, use a semi-custom design as agreed by the latest Cortex licensing agreement.